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by: Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan  List Price: $119.95 Amazon.com's Price: $103.14 You Save: $16.81 (14%)Prices subject to change. Availability: Usually ships in 24 hours
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Binding: HardcoverDewey Decimal Number: 621.381046 EAN: 9780849396250 Edition: 1 ISBN: 0849396255 Label: CRC Manufacturer: CRC Number Of Items: 1 Number Of Pages: 128 Publication Date: December 18, 1998 Publisher: CRC Studio: CRC Browse for similar items by category: Click to Display Editorial Review: Product Description: Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:ointerconnectionsoprinted circuit boardsosubstratesoencapsulantsodielectricsodie attach materialsoelectrical contactsothermal materialsosoldersElectronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging. Average Rating:
 Rating:  - Well organized reference bookThe material in the book is organized in a manner that makes it easy for a packaging engineer to find and use the information. It speaks the language of a practicing engineer. The reader can compare the competing materials for each application and make a decision about material choice. The property tables are all in international units which makes it easy to compare the information from otherr sources. The book provides a detailed list of references on each topic. It ... Read More Rating:  - This book is not very detailed or complete.This text is incomplete. It can best be characterized as an overview. The length is very short and the shallow nature of the content makes it not very useful for design work. It has truncated materials properties tables and one paragraph descriptions of the various issues packge designers are faced with. 
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