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Format: HTML Label: Society of Plastics Engineers, Inc. Manufacturer: Society of Plastics Engineers, Inc. Number Of Pages: 9 Publication Date: December 01, 1995 Publisher: Society of Plastics Engineers, Inc. Release Date: July 28, 2005 Studio: Society of Plastics Engineers, Inc. Browse for similar items by category: Click to Display Editorial Review: Product Description: This digital document is an article from Polymer Engineering and Science, published by Society of Plastics Engineers, Inc. on December 1, 1995. The length of the article is 2407 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser. From the author: A new stress monitoring technique, a stress-tracking device, is described here. It has been used to study some important properties of epoxy resin. Residual stresses, including a curing shrinkage stress and a cooling shrinkage stress, were measured automatically and continuously during curing and cooling. Simultaneously, information such as an apparent gelation time and glass transition temperature were obtained directly during the experiment. These epoxy resin properties were related to the extent of cure. Varying cure temperature produced changes of cure behavior, which resulted in different residual stresses. Citation Details Title: Assessment of residual stresses during cure and cooling of epoxy resins. Author: Hong-Bing Wang Publication: Polymer Engineering and Science (Refereed) Date: December 1, 1995 Publisher: Society of Plastics Engineers, Inc. Volume: v35 Issue: n23 Page: p1895(4) Distributed by Thomson Gale 
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